Advanced Ceramics for electronic applications: Substrates, circuit carriers and core materials made
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Published date: 20. Jan 2025
Modified date: 20. Jan 2025
- Location: Germany
Advanced Ceramics for electronic applications: Substrates, circuit carriers and core materials made of alumina and aluminum nitride components are laser treated, stamped grooved dry pressed extruded or film cast. Ceramic heat -sinks and cooling elements f
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