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Hermetic Packages for the protection and interconnection of several types of electronic or Photonic

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Published date: 9. Aug 2025

Modified date: 9. Aug 2025

Location: France

Hermetic Packages for the protection and interconnection of several types of electronic or Photonic chips Packaging Materials

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Name: EGIDE

Phone: 33130688100

Other: http://www.egide.fr

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