FCCL Materials

The flexible materials produced by Taihong, including flexible copper foil, coverlay films, pure adhesives, stiffeners, and composite laminates, not only boast inherent advantages such as flexibility, thinness, and light weight but also are actively advancing toward application fields requiring high-density fine circuits and high-frequency high-speed performance. Examples of such advanced materials include ion migration-resistant pure adhesives/coverlay films, as well as high-frequency pure adhesives, coverlay films, MPI, LCP, and fluoropolymer-based substrates. By offering the market more superior and diversified material options, Taihong has gained the trust and support of customers worldwide.
The flexible materials such as flexible copper foil, coverlay films, pure adhesives, stiffeners and composite laminates produced by Taihong are mainly used in the manufacturing of flexible printed circuits (FPC). These materials are widely applied in industries including consumer electronics, automotive electronics, industrial control, medical devices and communication equipment, and also extended to high-end fields like aerospace and new energy.
Endowed with properties of flexibility, thinness, light weight, high-density fine circuits and high-frequency high-speed transmission, these materials have become critical basic components to meet the demands of device miniaturization, integration and high-speed signal transmission.